发明名称 |
Cover tape for electronic part conveyance and electronic part conveying member |
摘要 |
<p>A cover tape for the electronic-part conveyance comprises at least four laminated layers of: a substrate (1); at least one layer of a base coating layer (2) and an intermediate layer (3), provided on the substrate (1); an adhesive layer (4), provided on the at least one layer of the coating layer (2) and the intermediate layer (3); and a conductive layer (5) formed on at least one of the rear surface of the substrate (1) and the front surface of the adhesive layer (4) by deposition. <IMAGE></p> |
申请公布号 |
EP1167224(B1) |
申请公布日期 |
2005.03.23 |
申请号 |
EP20010115835 |
申请日期 |
2001.06.28 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAKANO, ICHIRO;ICHIKAWA, HIROKI;IZUTANI, SEIJI |
分类号 |
B65D73/02;B65D65/40;B65D73/00;B65D85/86;(IPC1-7):B65D65/40 |
主分类号 |
B65D73/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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