发明名称 Cover tape for electronic part conveyance and electronic part conveying member
摘要 <p>A cover tape for the electronic-part conveyance comprises at least four laminated layers of: a substrate (1); at least one layer of a base coating layer (2) and an intermediate layer (3), provided on the substrate (1); an adhesive layer (4), provided on the at least one layer of the coating layer (2) and the intermediate layer (3); and a conductive layer (5) formed on at least one of the rear surface of the substrate (1) and the front surface of the adhesive layer (4) by deposition. <IMAGE></p>
申请公布号 EP1167224(B1) 申请公布日期 2005.03.23
申请号 EP20010115835 申请日期 2001.06.28
申请人 NITTO DENKO CORPORATION 发明人 NAKANO, ICHIRO;ICHIKAWA, HIROKI;IZUTANI, SEIJI
分类号 B65D73/02;B65D65/40;B65D73/00;B65D85/86;(IPC1-7):B65D65/40 主分类号 B65D73/02
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