| 摘要 |
PROBLEM TO BE SOLVED: To obtain an ultrasonic sensor which can sufficiently cool an ultrasonic resonator and can be reduced in size. SOLUTION: The ultrasonic sensor 10 is provided with a Peltier element 12, and an ultrasonic resonator 11 provided on a substrate surface of a cooling side substrate 12a of the Peltier element 12 and used to transmit/receive ultrasonic waves. With this configuration, since the Peltier element 12 having high cooling capability can cool the ultrasonic resonator 11 to suppress temperature rise of the ultrasonic resonator 11, the ultrasonic sensor 10 having stable sensor characteristics can be obtained. Furthermore, since the ultrasonic resonator 11 is provided on the substrate surface of the cooling side substrate 12a of the Peltier element 12, no substrate is required for holding the ultrasonic resonator 11, thereby reducing the ultrasonic sensor 10 in size. COPYRIGHT: (C)2008,JPO&INPIT
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