发明名称 METHOD FOR FORMING RUTHENIUM OXIDE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming a ruthenium oxide film in a recess having a high aspect ratio of 50 or above while ensuring a short incubation time, a high film forming rate, and a high step coverage. <P>SOLUTION: The method for forming a ruthenium oxide film includes: providing a substrate in a processing chamber; supplying a ruthenium compound having a structure in which two beta-diketons and two groups selected among olefin, amine, nitril, and carbonyl are coordinate-bonded to Ru in a vapor state onto the substrate; supplying oxygen gas onto the substrate; and forming a ruthenium oxide film on the substrate by reaction between the ruthenium compound gas and the oxygen gas. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013117067(A) 申请公布日期 2013.06.13
申请号 JP20120214090 申请日期 2012.09.27
申请人 TOKYO ELECTRON LTD 发明人 NORO NAOTAKA;ASHIZAWA HIROAKI;HARA JUNYA;IWAI TAKAAKI
分类号 C23C16/18;C23C16/40;C23C16/455;H01L21/28;H01L21/285;H01L21/8242;H01L27/108 主分类号 C23C16/18
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