发明名称 |
Cooling Hot-Spots by Lateral Active Heat Transport |
摘要 |
An apparatus includes a thermoelectric cooler adjacent to a surface of a device substrate and including a first set of one or more metal electrodes, a second set of one or more metal electrodes, and one or more semiconductor members. Each member includes a material different from the device substrate and physically joins a corresponding one electrode of the first set to a corresponding one electrode of the second set. The electrodes and at least one member are configured to transport heat to or from a thermal load in a direction parallel to the surface of the device substrate.
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申请公布号 |
US2009071525(A1) |
申请公布日期 |
2009.03.19 |
申请号 |
US20070856201 |
申请日期 |
2007.09.17 |
申请人 |
LUCENT TECHNOLOGIES, INC. |
发明人 |
HODES MARC SCOTT;KRISHNAN SHANKAR |
分类号 |
H01L35/32;H01L21/50 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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