发明名称 |
METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS |
摘要 |
MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die. |
申请公布号 |
US2016167949(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201414568845 |
申请日期 |
2014.12.12 |
申请人 |
Apple Inc. |
发明人 |
Jiang Tongbi;Zhao Jie-Hua;Hartwell Peter G. |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
|
主权项 |
1. A module comprising:
a module substrate; a surface mount substrate bonded to a top side the module substrate with an arrangement of conductive bumps including all conductive bumps bonding the surface mount substrate to the module substrate; wherein the arrangement of conductive bumps corresponds to an anchored area of the surface mount substrate directly over the module substrate, and the surface mount substrate includes a hanging area that laterally extends from the anchored area in which a conductive bump is not formed directly beneath the hanging area of the surface mount substrate; an integrated circuit (IC) die mounted on a front side of the surface mount substrate in the anchored area of the surface mount substrate; a micro-electro-mechanical systems (MEMS) die mounted on the front side of the surface mount substrate in the hanging area of the surface mount substrate; a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. |
地址 |
Cupertino CA US |