发明名称 |
Stackable semiconductor package |
摘要 |
A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.
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申请公布号 |
US8466545(B1) |
申请公布日期 |
2013.06.18 |
申请号 |
US201213528199 |
申请日期 |
2012.06.20 |
申请人 |
YOSHIDA AKITO;HEO YOUNG WOOK;AMKOR TECHNOLOGY, INC. |
发明人 |
YOSHIDA AKITO;HEO YOUNG WOOK |
分类号 |
H01L21/00;H01L23/02;H01L23/04 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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