| 发明名称 |
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MATERIAL |
| 摘要 |
A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together. |
| 申请公布号 |
US2016247739(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615047098 |
申请日期 |
2016.02.18 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Von Waechter Claus;Altschaeffl Christian;Doepke Holger;Hoeckele Uwe;Muehlbauer Franz Xaver;Porwol Daniel;Schmidt Tobias;Schweiger Christian;Von Koblinski Carsten |
| 分类号 |
H01L23/26;H01L23/00;H01L21/02;H01L23/29;H01L23/31 |
主分类号 |
H01L23/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonded system, comprising:
a reconstituted wafer comprising a hygroscopic material; a moisture barrier arranged over a surface of the reconstituted wafer; an adhesive layer arranged over a surface of the moisture barrier opposite the reconstituted wafer; and a carrier arranged over a surface of the adhesive layer opposite the moisture barrier, wherein the adhesive layer adhesively bonds the reconstituted wafer and the carrier together. |
| 地址 |
Neubiberg DE |
