| 发明名称 |
WAFER SUPPORT DEVICE |
| 摘要 |
A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided. |
| 申请公布号 |
US2016247709(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615145382 |
申请日期 |
2016.05.03 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHENG Tien-Chih;ZHANG Ying;SUEN Shu-Huei;KAO Chen-Chiao |
| 分类号 |
H01L21/687;B05B13/02;B05B15/00;H01L21/683 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer support device, comprising:
a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon, wherein each of the plurality of support portions is arranged at equal intervals with respect to adjacent support portions, and wherein the plurality of support portions are arranged in parallel lines such that the plurality of support portions in adjacent lines are offset from each other. |
| 地址 |
Hsinchu TW |
