DISPLAY MODULE ENCAPSULATION STRUCTURE AND PREPARATION METHOD THEREOF

摘要

A display module encapsulation structure and preparation method thereof, which relates to the field of display devices and can be applied in preparing AMOLED and other related display devices. The structure and method thereof mainly seals and protects the display module by utilizing the thin film encapsulation structure. That is to say, seal the display module by inorganic thin film layer which has the characteristics of transparency as well as water-resistance oxygen, buffer the internal and external stress of the thin film layer by preparing the organic module outside to the inorganic thin layer, and restrain the film layer falling off caused by the bending stress when making flexible devices. The thin film encapsulation instead of fit encapsulation can effectively improve the mechanical strength of the whole display device.

主权项

1. A display module encapsulation structure comprising:
an array substrate, a surface of which being provided with a display module; a bank structures disposed on the surface of the array substrate and placed in the periphery of the display module; a first film layer covering the display module as well as the surface of the array substrate between the display module and the bank structures to seal the display module; a second film layer covering the first film layer as well as a part of a surface of the bank structures; and a third film layer covering the second film layer and the bank structures, and contacting a part of the surface of the array substrate.