WIRE-BONDING APPARATUS AND WIRE-BONDING CONTROL METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wire-bonding apparatus and a wire-bonding control method using the same which are capable of resolving a bouncing problem without the need for a clamp during a conventional bonding process, by clamping a wire-bonding target using supports in the vicinity of a wire-bonding point.

SOLUTION: A wire-bonding apparatus 100 comprises: a bonding head 110; at least two supports 120 connected to the bonding head 110; a holder guide 150 connected to the bonding head 110 and discharging a wire 200 between the supports 120; a wedge 140 connected to the bonding head 110 and used to attach the wire 200 to a bonding point between the supports 120; and a cutter 130 connected to the bonding head 110 and used to cut the wire 200.

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