| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for measuring the shape and thickness variation of a wafer. <P>SOLUTION: An interferometer system includes two reference plates 32 and 52 placed apart from each other such that the corresponding reference plates form a hollow between them, where a polished opaque plate is arranged. The surfaces of the plate are approximately 2.5 millimeters or less from the corresponding reference surfaces when the plate is arranged in the hollow. The interferometer system also includes two interferometer devices 20 and 40 arranged at the opposite sides of the hollow in order to create distribution of the surfaces of the plate. Luminous sources 24 and 44 are optically connected to the interferometer devices 20 and 40. The luminous source includes a luminous body set to generate light of a plurality of wavelengths, and an optical amplification modulator set to stabilize an output of the light generated by the luminous body. <P>COPYRIGHT: (C)2013,JPO&INPIT |
