| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a highly reliable memory card small in an effect to the mounting of an element eve when a bend occurs in the memory card and suppressing the probability low such as a crack, a break in a mounting connection part or, a fault, a break in the element itself. SOLUTION: A surface that a memory and the other elements arranged on a circuit board incorporated in a memory card are connected with the circuit board is made nearly to coincide with the surface without a length change before/after bend deformation, that is, a neutral surface. A frame 2 is a header part 6 for connecting integrated circuits 4 and surface mounting elements 5 arranged on the circuit board 1 with a main body. The neutral surface 7 without the length change regardless of the presence/absence of the bend deformation is made nearly to coincide with a connection surface between the mounted elements, that is, the integrated circuit 4, the surface mounting elements 5 and the circuit board 1. For realizing that, the position that the mounting surface comes is selected properly or the material quality, the size, etc., of the structural substance are selected and the thickness of e.g. a surface panel 3 or the rigidity of the material is adjusted.</p> |
