| 摘要 |
A method for dicing semiconductor wafers is provided in which data present on the primary surface of the semiconductor wafers is recognized and used to controlling the cutting operation. The combination of the controller and the cutting means allows for the cutting of complex and non-linear shapes and allows for the combination of more than one semiconductor chip edge profile on a semiconductor wafer. The cutting means is preferably a laser or other cutting device capable of cutting fine patterns without causing undue damage to the semiconductor wafer or the resulting semiconductor chips. The more complex profiles of the semiconductor chips that may be produced with this method may, in turn, be utilized to improve the density within semiconductor device packages and/or on mounting substrates such as a printed circuit boards. The present invention can, therefore, improve space utilization, reduce fabrication expenses, reduce processing time and simplify package manufacture.
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