| 摘要 |
PROBLEM TO BE SOLVED: To obtain a solder bonding method capable of selectively irradiating a laser beam to a portion where a desired solder bonding is carried out without changing any output of a laser oscillator. SOLUTION: The solder bonding method comprises the steps of: having a laser beam transparent region in a region corresponding to a joint, preparing a silica glass having a laser beam reflecting region at a non-connecting portion pinched by at least the joint, aligning the joint with the laser beam transparent region and the non-connecting portion with the laser beam reflecting region, respectively to install the silica glass, and scanning the laser beam. COPYRIGHT: (C)2007,JPO&INPIT |
