| 发明名称 |
SEMICONDUCTOR SUBSTRATE POLISHING METHOD AND SEMICONDUCTOR DEVICE POLISHING APPARATUS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate polishing method utilizing a soft polishing pad; and provide a semiconductor substrate polishing apparatus including a soft polishing pad. <P>SOLUTION: A semiconductor substrate polishing method of an embodiment comprises: a lapping step of lapping a surface of a semiconductor substrate; and a polishing step of polishing the lapped semiconductor substrate. The polishing step is performed by a slurry including a polishing pad and a polishing material each having a Shore D hardness of 65 and under. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013125969(A) |
申请公布日期 |
2013.06.24 |
| 申请号 |
JP20120272160 |
申请日期 |
2012.12.13 |
| 申请人 |
SAMSUNG CORNING PRECISION MATERIALS CO LTD |
发明人 |
EO SUNG WOO;KIM KYOUNGJUN |
| 分类号 |
H01L21/304;B24B37/00;B24B37/10;B24B37/24 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
