THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING PASSIVE DEVICE APPLIED TO THE THREE-DIMENSIONAL PACKAGE MODULE

摘要

Provided is a three-dimensional aluminum package module including : an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.