| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board capable of well forming a solder resist pattern while inhibiting degradation in productivity. SOLUTION: The manufacturing method includes a step of bringing a stamp surface of a stamp member for applying a repellent material in a predetermined pattern into contact with a base material having a wiring pattern formed to form a repellent region of the predetermined pattern through repellent material transfer to the base material, and a step of discharging, through a discharging head, a functional liquid containing solder resist outside the repellent region where the repellent material is transferred to form a solder resist pattern in a predetermined region of the base material with the wiring pattern formed. COPYRIGHT: (C)2008,JPO&INPIT
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