发明名称 Camera module facilitating heat dissipation
摘要 A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust.
申请公布号 US8471948(B2) 申请公布日期 2013.06.25
申请号 US201113113943 申请日期 2011.05.23
申请人 HOU SHENG-HUNG;LAI WEN-CHING;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HOU SHENG-HUNG;LAI WEN-CHING
分类号 H04N5/225 主分类号 H04N5/225
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