发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition combinedly having excellent properties of an aromatic polyamide resin and excellent performances of molding properties, and having more excellent resistance to heat-aging and moisture resistance in comparing to usual aromatic polyamide resin compositions. SOLUTION: This polyamide resin contains (C) 0.01-1 pt.wt. of acopper compound, (D) 0.01-5 pts.wt. of an alkali metal halide compound and (E) 0.05-5 pts.wt. of an organic-based stabilizer to a total of 100 pts.wt. of (A) 95.5-50 pts.wt. of a polyamide resin composed of a dicarboxylic acid component unit comprising an aromatic dicarboxylic acid and an aliphatic dicarboxylic acid and a diamine component unit comprising a heterocyclic diamine and an aliphatic diamine and having 1.5-5.0 relatice viscosity measured in concentrated sulfuric acid at 20 deg.C and (B) 0.5-50 pts.wt. of a modified polyolefin.
申请公布号 JP2000319507(A) 申请公布日期 2000.11.21
申请号 JP19990132823 申请日期 1999.05.13
申请人 TOYOBO CO LTD 发明人 HIRAMATSU TOSHIO;TAMURA TSUTOMU;YOSHIDA HIDEKAZU
分类号 C08L77/06;C08K3/10;(IPC1-7):C08L77/06 主分类号 C08L77/06
代理机构 代理人
主权项
地址