| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding device of a semiconductor component capable of preventing the semiconductor component from getting damaged due to electrification of a holding tool. SOLUTION: In the thermocompression bonding device of the semiconductor component for thermocompression-bonding a chip 6 with a substrate 4, a thermocompression bonding head 16 is constituted such that the holding tool 12 is detachably mounted on a ceramic heater 23 provided on an electrically grounded conductive liftable block 20 and generating heat by applying AC voltage. In addition, a conductive spring member 27 conductive with the block 20 via a conductive cord 28 is brought into contact with the holding tool 12, thereby keeping the tool 12 always electrically grounded. COPYRIGHT: (C)2007,JPO&INPIT
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