| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor device inexpensively, and whose mounting efficiency is high. SOLUTION: This semiconductor device 100 is provided with a semiconductor chip 1 and a solder ball 8 electrically connected to a wiring pattern 5 on one surface of a flexible substrate 11 on whose one surface the wiring pattern 5 is formed. The flexible substrate 11 is provided with a first region 11a equipped with a semiconductor chip 1, and a second region 11b equipped with the solder ball 8. The flexible substrate 11 is bent so that the back face of the first region 11a and the back face of the second region 11b can be faced to each other. COPYRIGHT: (C)2007,JPO&INPIT
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