| 摘要 |
PROBLEM TO BE SOLVED: To prevent protrusion of an adhesive and improve adhesive properties by reserving excess adhesive, forced out between a semiconductor chip and a cover plate, in the outer peripheral part of the semiconductor chip or in the cover plate. SOLUTION: The semiconductor chip 110 is bonded to a cover glass 112 via the adhesive 116. Recessed parts 110A, 112A for preventing protrusion of the adhesive 116 are provided at the outer peripheral end surfaces of the semiconductor chip 110 and the cover glass 112. When the adhesive 116 is protruded, upon bonding the semiconductor chip 110 to the cover glass 112, the excessive adhesive is absorbed into the recessed parts 110A, 112A for preventing the protrusion, whereby the adhesive will not be forced out so much and is reserved in the recessed parts 110A, 112A for preventing the protrusion of the same. According to this method, the character of product of a package is improved and the selection and the securing of strength of the adhesive are facilitated on development, further, the control and the management of the adhesive on manufacturing are facilitated. COPYRIGHT: (C)2004,JPO |
