| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is ensured of interlayer connection and high in reliability. SOLUTION: A wiring pattern is equipped with a land for interlayer connection, a connection body is equipped with a land for interlayer connection with the wiring pattern, a conductor post is formed on the land of either the wiring pattern or the connection body, a solder layer is formed on the tip of the conductor post or on the surface of the opposed land, and the conductor post and the opposed land are brought into close contact with each other through the intermediary of an adhesive agent layer and soldered together by thermocompression for the formation of a multilayer wiring board, where the solder layer is thermally treated before contacting, pressing, and heating are performed. |
