SUPPORT GLASS SUBSTRATE AND LAMINATE USING SAME

摘要

The present invention addresses a technical problem of producing a support substrate that is less likely to cause a change in dimension of a processing substrate and a laminate using the support substrate, and thereby contributing to high-density mounting of a semiconductor package. The present invention is characterized in that the average coefficient of linear thermal expansion in a temperature range from 20 to 200°C is more than 110 × 10-7/°C and not more than 160 × 10-7/°C.