| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure with solder capable of inhibiting a shrinkage cavity from being generated with a comparatively simple configuration.SOLUTION: A structure with solder includes: a circuit board 10 on which a semiconductor element 4 is mounted; a cooling metal member (heat sink) 7 for cooling the circuit board; a solder layer 6 which is interposed between solder joining surfaces 5A and 7A provided on the circuit board and the cooling metal member to join both members; and a recess 50 which is formed on the solder joining surface side of the cooling metal member and holds a part of solder during melting.SELECTED DRAWING: Figure 2 |
