| 发明名称 |
Lead-Free Solder Ball |
| 摘要 |
Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board. |
| 申请公布号 |
US2016339543(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201615196227 |
申请日期 |
2016.06.29 |
| 申请人 |
Senju Metal Industry Co., Ltd. |
发明人 |
Ohnishi Tsukasa;Yamanaka Yoshie;Tachibana Ken |
| 分类号 |
B23K35/02;H05K3/34;C22C13/00;H01L23/00;B23K1/00;B23K35/26 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for mounting a BGA or CSP on a printed circuit board, the process comprising:
melting and fusing together solder paste and a solder ball which has a solder composition comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn, wherein the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board. |
| 地址 |
Tokyo JP |
