发明名称 MOLD TRANSFER ASSEMBLIES AND METHODS OF USE
摘要 A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
申请公布号 US2016339515(A1) 申请公布日期 2016.11.24
申请号 US201514787133 申请日期 2015.01.28
申请人 HALLIBURTON ENERGY SERVICES, INC. 发明人 Atkins William Brian;Ownby Clayton Arthur;Clark Michael;Cook, III Grant O.;Olsen Garrett T.
分类号 B22D27/04;B22D33/00;B22D19/06 主分类号 B22D27/04
代理机构 代理人
主权项 1. A mold transfer assembly, comprising: a transfer housing providing an interior defined by one or more sidewalls and a top, the transfer housing being sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink; and an arm coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink, wherein the transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
地址 Houston TX US