发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having reduced parasitic resistance between a source electrode and a drain electrode and having improved on-characteristics, and to provide a semiconductor device having high reliability.SOLUTION: To a conductive oxide film including an oxide semiconductor to which an impurity element is added, the impurity element in a partial region of the oxide film is replaced with oxygen to form a high-resistance semiconductor region. A low-resistance region where the impurity element is not replaced with oxygen is used as a source region and a drain region, and the high-resistance semiconductor region where the impurity element is replaced with oxygen is used as a channel formation region.SELECTED DRAWING: Figure 2
申请公布号 JP2016219851(A) 申请公布日期 2016.12.22
申请号 JP20160187951 申请日期 2016.09.27
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YOKOI TOMOKAZU;TOKUMARU RYO;YOSHIZUMI KENSUKE
分类号 H01L21/336;H01L29/786 主分类号 H01L21/336
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