发明名称 MOLDING DIE AND HOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To keep a resin in a sprue section at the mold melting point viscosity without being cured, use the resin in the following molding and carry out the continuous molding by providing a plurality of recesses and projections on the outer periphery of a sprue bush and a cylindrical heat insulation section on the outer periphery of a space, and making a flow path for a cooling medium small. SOLUTION: A plurality of recesses and projections 14 are formed on the outer periphery of a sprue bush 13, and a cylindrical heat insulation section 10 formed of a material of low thermal conductivity such as a ceramic, a gypsum, a laminate or a plastic is formed inside a cutting face of a mold 7. A cooling medium is brought into contact with the sprue bush 13 with good efficiency, and as a result cooling is carried out effectively to control the resin temperature rise and cool a sprue section 16 uniformly and with good efficiency and cool uniformly without curing the molten resin in the bush. The resin in the sprue bush 13 is kept at the moldable melting viscosity to use the resin in the following molding, carry out the continuous molding and improve the yield.
申请公布号 JP2000317993(A) 申请公布日期 2000.11.21
申请号 JP20000049295 申请日期 2000.02.25
申请人 SUMITOMO BAKELITE CO LTD 发明人 HIBINO FUMITOMO
分类号 B29C33/04;B29C33/38;B29C45/27;B29C45/73;(IPC1-7):B29C45/27 主分类号 B29C33/04
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