发明名称 Ultrasonic sensor
摘要 Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.
申请公布号 US8492954(B2) 申请公布日期 2013.07.23
申请号 US201113326073 申请日期 2011.12.14
申请人 KIM BOUM SEOCK;PARK EUN TAE;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM BOUM SEOCK;PARK EUN TAE
分类号 H01L41/08 主分类号 H01L41/08
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