发明名称 DEVICE AND METHOD FOR FORMING A THREE-DIMENSIONAL CIRCUIT BOARD
摘要 A device and a method for forming a three-dimensional circuit board are provided to attach a circuit board through a surface of a roller of a circumferential shape or a cylindrical shape, especially, an entire circumference with position precision. A device for forming a three-dimensional circuit board includes a rotational unit(10), a retaining unit(20), and a control unit(30). The rotational unit maintains a central axis of a target(1) having a circumferential shape or a cylindrical shape in a horizontal state. The rotational unit is rotated around the central axis as a rotary axis. The retaining unit retains a downwardly directed state of an adhesive layer of a circuit board(2). The retaining unit is transferred horizontally. The control unit controls a relatively position to form a contacting state between the surface of the rotating target and the adhesive layer of the transferred circuit board. The control unit controls constantly the pressure of the circuit board.
申请公布号 KR20090063098(A) 申请公布日期 2009.06.17
申请号 KR20080119519 申请日期 2008.11.28
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 OKADA HIROSHI;ISHIDA FUMIAKI;YOSHIDA TAYURU
分类号 H05K3/38;H05K3/46 主分类号 H05K3/38
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