Integrated antenna package

摘要

An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.

主权项

1. A packaged device comprising:
an integrated circuit die coupled to a first side of an interposer, the integrated circuit die to receive a millimeter wavelength signal; a microstrip feedline on the first side of the interposer, the microstrip feedline coupled to the integrated circuit die to receive the millimeter wavelength signal; a ground plane on a second side of the interposer, the second side opposing the first side, the ground plane comprising a slot resonator aligned over an end portion of the microstrip feedline; an antenna structure attached to the second side of the interposer, a cavity formed between the antenna structure and the ground plane on the second side, the cavity aligned with the slot resonator; and a cover overlying the integrated circuit die and the microstrip feedline, an air-filled gap resides between the cover and the die and overlies the die, the cover comprising a lossy EBG structure directly overlying the integrated circuit die, and a lossless EBG structure directly overlying the microstrip feedline.