发明名称 ELECTRO-PLATING METHOD AND PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electro-plating method and an electrode jig which use indirect power feeding, capable of being applied to a terminal component having a complicated three-dimensional shape and an insulation substrate having many independent electrodes.SOLUTION: A plating device 50 using indirect power feeding and using a bipolar phenomenon, comprises: a direct current power source 81; a plating bath 82; an anode plate 86 and a cathode plate 89 connected to the direct current power source 81, in which electrode parts thereof are immersed into the plating bath 82; and a turn table 90 suspended in the plating bath 82 and rotating and driven during work. The turn table 90 contains a holder 93 to which a bar-state matter 84 subjected to plating, and the matter 84 subjected to plating on the holder 93 is made pass and circulate a space sandwiched by the anode plate 86 and the cathode plate 89 so that the matter does not contact, by rotation of the turn table 90 during plating work, in which positive voltage and negative voltage are applied to the space between the anode plate 86 and the cathode plate 89 by the direct current power source 81.SELECTED DRAWING: Figure 8
申请公布号 JP2016121401(A) 申请公布日期 2016.07.07
申请号 JP20160003995 申请日期 2016.01.13
申请人 NEC SCHOTT COMPONENTS CORP 发明人 NISHIWAKI SUSUMU
分类号 C25D21/00;C25D21/10 主分类号 C25D21/00
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