SYSTEMS AND METHODS FOR RECYCLING ELECTRONIC SYSTEMS

摘要

In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.

主权项

1. A method of recycling a device comprising a plurality of electronic components disposed over a composite material, the composite material comprising a substrate and a patternable material disposed thereover, wherein the patternable material is patterned to form a pattern therein, the method comprising:
receiving a portion of the device; removing one or more electronic components from the received portion of the device; urging one or more regions of the received portion of the device toward an abrasion head, whereby the abrasion head mechanically removes at least a portion of the patternable material in each of the one or more regions; and repeating the above steps for one or more portions of the device.