| 发明名称 |
COOLING MODULE |
| 摘要 |
A cooling module is used to cool an electronic component, the cooling module includes a shell and a radiator which is received in the shell. The shell includes a receiving portion which is used to receive the radiator. Two sides of the receiving include two latch pieces, the latch piece defines a latch hole. Two sides of the radiator include two protrusive blocks, the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell. |
| 申请公布号 |
US2016219753(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201514691283 |
申请日期 |
2015.04.20 |
| 申请人 |
HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
HE TING-TING;WU ZHI-PING |
| 分类号 |
H05K7/20;H05K5/00 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling module used to cool an electronic component, comprising:
a shell comprised a receiving portion, two sides of the receiving portion comprising two latch pieces, each latch piece defining a latch hole; and a radiator, two sides of the radiator comprising two protrusive blocks; wherein the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell. |
| 地址 |
Wuhan CN |
