| 发明名称 |
METHOD OF FABRICATING DISPLAY DEVICE USING BONDING APPARATUS AND DISPLAY DEVICE |
| 摘要 |
A method of fabricating a display device using a bonding apparatus, the method including arranging a second substrate on a first substrate in which a plurality of pixels is formed, and bonding the first substrate and the second substrate to each other; providing the first substrate and the second substrate on a stage, and compressing a driver integrated circuit (IC) on the first substrate and simultaneously forming a reinforcing material on the first substrate; and compressing a flexible printed circuit board on the first substrate. |
| 申请公布号 |
US2016219695(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201514740515 |
申请日期 |
2015.06.16 |
| 申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
CHOI Suk Ho |
| 分类号 |
H05K1/02;H05K1/18;H05K3/30 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a display device using a bonding apparatus, the method comprising:
arranging a second substrate on a first substrate in which a plurality of pixels is formed, and bonding the first substrate and the second substrate to each other; providing the first substrate and the second substrate on a stage, and compressing a driver integrated circuit (IC) on the first substrate and simultaneously forming a reinforcing material on the first substrate; and compressing a flexible printed circuit board on the first substrate. |
| 地址 |
Yongin-City KR |
