| 摘要 |
The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (1), having a main surface (111) and a back surface (112) facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (8), which is disposed over the substrate (1); and a conductive layer (3), which is electrically connected with the electronic component (8); wherein a recess for disposing the component (14) and a through recess (17) are formed in the substrate, in which recess for disposing the component (14) is recessed from the main surface (111), and the through recess (17) penetrates from the recess for disposing the component (14) to the back surface (112); the electronic component (8) is disposed over the recess for disposing the component (14); a metal-filled portion (4) is formed in the through recess (17), wherein the metal-filled portion blocks at least the bottom of the through recess (17) and is filled with a metal material; and the conductive layer (3) is formed at least from the through recess (17) to the back surface (112). |
| 主权项 |
1. An electronic device, comprising:
a substrate, having a main surface and a back surface facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component, disposed over the substrate; and a conductive layer, electrically connected with the electronic component; wherein, a recess for disposing the component and a through recess are formed in the substrate, wherein the recess for disposing the component is recessed from the main surface, and the through recess penetrates from the recess for disposing the component to the back surface; the electronic component is disposed over the recess for disposing the component; a metal-filled portion is formed in the through recess, wherein the metal-filled portion blocks at least a bottom of the through recess and is filled with a metal material; and the conductive layer is formed at least from the through recess to the back surface. |
