| 发明名称 |
ADHESIVE FILM AND FLEXIBLE METAL LAMINATE |
| 摘要 |
To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm. |
| 申请公布号 |
US2016242274(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615140912 |
申请日期 |
2016.04.28 |
| 申请人 |
ASAHI GLASS COMPANY, LIMITED |
发明人 |
HOSODA Tomoya;NISHI Eiichi;SASAKI Toru;MATSUOKA Yasuhiko;KASAI Wataru |
| 分类号 |
H05K1/02;H05K3/46;C09J127/18;H05K1/03;H01P3/08;C09J7/02;H05K3/06;H05K3/22 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein
the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm. |
| 地址 |
Chiyoda-ku JP |
