MANUFACTURING DEVICE OF SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A manufacturing device of a semiconductor package and a manufacturing method thereof are provided. The manufacturing device of a semiconductor package comprises a mold unit configured to form a cavity which is a molding space. The mold unit comprises: a first mold; a second mold coupled to the first mold to form the cavity; a supply part configured to supply a molding resin to the cavity; and a vent part arranged to be opposite to the supply part. The vent part comprises a first vent part fixed in the mold unit, and a second vent part movable with respect to the first vent part.