RESIN COMPOSITION, BACKSIDE-GRINDING TAPE-INTEGRATION TYPE SHEET-LIKE RESIN COMPOSITION, DICING TAPE-INTEGRATION TYPE SHEET-LIKE RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having excellent shelf stability, with quick curability in a process of manufacturing a semiconductor device.SOLUTION: A resin composition is used for sealing an interface between an adhered and a semiconductor device, flip chip-connected on the adhered. The resin composition includes a radical reactive compound, a thermoplastic resin, and an inorganic filler. The resin composition includes 18.5 wt.% or more radical reactive compound with regard to components excluding the inorganic filler from the whole resin composition.SELECTED DRAWING: Figure 1