<p>A ball capturing device and a ball capturing method for capturing one ball from a plurality of balls of the same size and a solder ball arranging device and a solder ball arranging method for arranging solder balls with solder at prescribed positions on a circuit board, wherein one ball is securely captured from the plurality of balls of the same size. The ball capturing device comprises a storage body (111) in which a small hole (1111) larger in size than one ball (B) and smaller in size than two balls is formed in the upper part of a storage wall (111a) enclosing a space (S) storing the plurality of balls (B) of the same size, a blow-up means (112) blowing up the balls B stored in the storage body (111), and a capturing means (12) capturing the balls (B) blown up by the blow-up means (112) and reaching the hole (1111).</p>
