| 摘要 |
<p>Methods for cooling semiconductor devices having a light-emitting surface and associated devices are disclosed and described. Such a device (10) may include a light-emitting surface (16) and a diamond layer (14) disposed on at least a portion of the light-emitting surface (16). The diamond layer (14) may be exposed to air in order to accelerate movement of heat away from the light-emitting surface (16) and into the air.</p> |
