WIRELESS IC DEVICE INSPECTING SYSTEM AND WIRELESS IC DEVICE MANUFACTURING METHOD USING THE SAME

摘要

Provided are a wireless IC device inspecting system for surely measuring characteristics of each wireless IC device in a short time, and a wireless IC device manufacturing method using such system. The system for inspecting a wireless IC device (1) is provided with a wireless IC chip (2) and a radiation plate (3). A high frequency signal is supplied by bringing the leading end of a probe (15) of an inspecting apparatus (10) into direct contact with a part of the radiation plate (3), and the characteristics of the wireless IC device (1) are measured. The leading end of the probe (15) is a flat plate (16) having improved adhesiveness and stability to the radiation plate (3).