,申请号JP20080506568-传众专利搜索

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法人/股东/高管

发明名称
摘要	Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.
申请公布号	JP2008537338(A)	申请公布日期	2008.09.11
申请号	JP20080506568	申请日期	2006.04.11
申请人		发明人
分类号	H05K1/14;H01R4/04;H01R11/01;H05K1/02;H05K3/36	主分类号	H05K1/14
代理机构		代理人
主权项
地址

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