| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit structure in which temperature rise at the circuit portion can be suppressed. SOLUTION: The circuit structure comprises a metal plate 2a, a circuit portion 4 provided on the metal plate 2a through an insulating layer 3, and a coating layer 5 provided on the circuit portion 4. The insulating layer 3 consists of a thin film of diamond-like carbon. COPYRIGHT: (C)2008,JPO&INPIT |
