| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of accurately connecting with a mother board. <P>SOLUTION: The semiconductor device comprises a semiconductor constituent having a plurality of external connection electrodes; an insulating base member provided on a side of the semiconductor constituent; an insulating layer provided on an upper surface excepting the external connection electrodes of the semiconductor constituent, and on an upper surface of the insulating base member; and at least one layer or more of upper layer rewiring layers provided on the insulating layer, and connected to the external connection electrode of the semiconductor constituent and having connection pads. A non-through hole of the upper layer rewiring layer is formed in the upper layer insulating layer by taking a part of the external connection electrodes of the semiconductor constituent as an alignment mark. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
