| 发明名称 | Camera module and electronic device for cooling image sensor | ||
| 摘要 | There is provided a camera module including an image sensor unit that is configured to include an image sensor and a mounting board, a sheet-shaped heat radiation member that comes into contact with a part of the image sensor unit and a component other than the image sensor unit and is elastically deformed so that an imaging surface of the image sensor unit is moved, and an actuator that elastically deforms the sheet-shaped heat radiation member so that the imaging surface of the image sensor unit is moved. | ||
| 申请公布号 | US9386200(B2) | 申请公布日期 | 2016.07.05 |
| 申请号 | US201313955703 | 申请日期 | 2013.07.31 |
| 申请人 | Sony Corporation | 发明人 | Hongo Kazuhiro |
| 分类号 | F03G7/06;H05K7/00;H04N5/225 | 主分类号 | F03G7/06 |
| 代理机构 | Chip Law Group | 代理人 | Chip Law Group |
| 主权项 | 1. A camera module comprising: an image sensor unit that includes an image sensor and a mounting board; a sheet-shaped heat radiation member that includes a first portion configured to come into contact with a part of the image sensor unit and a second portion configured to come into contact with a motherboard, wherein the sheet-shaped heat radiation member is configured to elastically deform so that the first portion of the sheet-shaped heat radiation member and an imaging surface of the image sensor unit are moved in a direction of an optical axis of light incident on the imaging surface; and an actuator surrounded by the sheet-shaped heat radiation member, wherein the actuator is configured to elastically deform the sheet-shaped heat radiation member so that the imaging surface of the image sensor unit is moved. | ||
| 地址 | Tokyo JP | ||