| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad that can feed a sufficient amount of polishing slurry to a place requiring polishing slurry for polishing and can reduce the amount of polishing slurry to be used.SOLUTION: A polishing pad, the surface of which polishing slurry is fed to, capable of polishing a workpiece while rotating comprises a polishing layer 1 configured so that one surface of which can polish a workpiece and a base layer 2 being laminated on the other surface of the polishing layer 1, in which the layer 1 has a plurality of through holes 1a that are opened in the thickness direction, the base layer 2 opens in one surface that is laminated with the polishing layer 1 and has groove parts 2a that communicate the through holes 1a, in which the groove parts 2a are configured to have circular arc shapes that extend from the center of the one surface of the base layer 2 to the circumference and protrude in the direction opposite to the rotation direction.SELECTED DRAWING: Figure 3 |
