| 摘要 |
PROBLEM TO BE SOLVED: To ensure supplying of power for plating of a circuit board, to improve a processing quality, and to form a circuit efficiently, by a simple structure, in a method of manufacturing the circuit board and in the circuit board manufactured by the same. SOLUTION: In a substrate forming step, leads 301 for supplying power are insert-molded and an insulating substrate 101 joined to the leads 301 is formed. In a circuit pattern forming step, the insulating substrate 101 is metallized and a circuit pattern 2 connected to the leads 301 is formed. In a circuit forming step, power is supplied to the circuit pattern 2 via the leads 301 to conduct electroplating. In a lead separating step, the leads 301 are separated from the insulating substrate 101 to obtain a three-dimensional circuit board 1. By this method, the circuit board 1 can be obtained without cutting the leads 301 for supplying power for electroplating, and without processing the main body of the circuit board 1 for dissolution of a feeding circuit from the circuit board 1. COPYRIGHT: (C)2005,JPO&NCIPI |
