| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board capable of easily forming an insulating film uniform in thickness over the entire area of a wiring pattern without influenced by the roughness and fineness of the wiring pattern. SOLUTION: An interlayer insulating film 14a for covering the wiring pattern 12a is formed by making the substrate 10 having the wiring pattern 12a electrostatically attract a resin 14x. Via holes are formed at predetermined portions of the interlayer insulating film 14a on the wiring pattern 12a, and an upper side wiring pattern connected with the wiring pattern 12a via the via holes is formed on the interlayer insulating film 14a. COPYRIGHT: (C)2005,JPO&NCIPI |
